Products
Singi™
Low Dk/Df Siloxane PCB Resin/Film
SingiTM is the low dielectric constant(Dk)/dissipation factor(Df) thermosetting resin and glass-fabric reinforced pre-preg film based on the siloxane chemical. They can apply to high frequency (microwave) applications such as 5G/6G communication, RADAR sensor in automobiles, large-capacity high-speed electronic substrates, and bonding/build-up film semiconductor packaging. The fabricated Cu Clad Lamination (CCL) is used for 5G/6G communication PCB and antenna.
Features
- Low dielectric constant(Dk=2.92 @10 GHz)/dissipation factor(Df=0.0016 @10 GHz)
- High heat/humid stability No change in dielectric properties
- Direct lamination and good adhesion with Cu foil
- No halogen (fluorine) content and low carbon content
- Quartz-fabric Reinforced Pre-preg (QFRP) film Dk=3.2, Df=0.0014 @10 GHz CTE : ~10 ppm/oC
Singi™G
Base siloxane formulation with the lowest Dk/Df
Curing Condition
- 200℃ – 250℃ in inert atmosphere for > 2hrs
Specification (Resin Film)
- Dk = 2.92, Df = 0.0016 @ 10 GHz
- CTE : ~80ppm/℃ (0℃~250℃), No glass transition
- Tensile strength : 29 MPa, Elastic modulus : 1.4GPa, Elastic strain : ~2%
Specification (QFRP Film)
- Quartz-fabric Reinforced Prepreg (QFRP) Film
- Dk = 3.20, Df = 0.0014 @ 10 GHz
- CTE : ~10ppm/℃ (0℃~250℃)
- Tensile strength : 214 MPa, Elastic modulus : 8.9 GPa, Elastic strain : ~3.0 %
Microwave Transmission Characteristics
Transmission Loss (dB/100mm)
* LCP data from Kuraray VECSTARTM Brochure
Singi™C
High-viscosity siloxane formulation for B-stage prepreg film
Curing Condition
- 200 ℃ – 250 ℃ in inert atmosphere for > 2hrs
Specification (Resin Film)
- Dk = 2.92, Df = 0.0016 @ 10 GHz
- CTE : ~80ppm/℃ (0℃~250℃), No glass transition
- Tensile strength : 29 MPa, Elastic modulus : 1.4GPa, Elastic strain : ~2%
Specification (QFRP Film)
- Quartz-fabric Reinforced Prepreg (QFRP) Film
- Dk = 3.20, Df = 0.0014 @ 10 GHz
- CTE : ~10ppm/℃ (0℃~250℃)
- Tensile strength : 214 MPa, Elastic modulus : 8.9 GPa, Elastic strain : ~3.0 %
Singi™F
Stretchable Low Dk/Df Siloxane Elastomer
Singi™F is the highly elastic, stretchable low Dk/Df siloxane formulation suitable for use in foldable FPCB or semiconductor packaging substrates/films
Singi™F Series
1. Singi™FG
- Highly Elastic low Dk/Df siloxane with crosslinked linear chemical structure
- Glass-Rubber transition at 20℃
2. Singi™FC
- Highly Elastic low Dk/Df siloxane with branched chemical structure
- Glass-Rubber transition at 70℃
Features
- Low modulus and high elastic strain (stretchable/flexible)
- Low Dk/Df in the microwave frequency region
- Zero/tunable CTE glass-fabric reinforced prepreg (GFRP) film for applications to PCB and semiconductor packaging substrates/films
- Bonding characteristics of prepreg film and siloxane resin for simpler multi-layer PCB production and build-up film
- Application to highly foldable FPCB and advanced stress–free semiconductor packaging
Tensile Test
Thermal Expansion
Singi™FG
Stretchable siloxane elastomer formulation
Curing Condition
- 200 ℃ in air for > 2hrs
- Lower temperature curing in air
Dielectric Properties
- SingiTM FG : Dk = 2.90, Df = 0.0022 @ 10 GHz
- SingiTM FC : Dk = 2.92, Df = 0.0025 @ 10 GHz
Specification (QFRP Film)
~40mm film with quartz-fabric (Shinetsu SQ, 30mm), ~50% resin content
Tensile Test (QFRP Film)
Thermal Expansion (QFRP Film)
- Tensile strength : 58.5 MPa
- Elastic modulus : 923 MPa
- Elastic strain : ~10%
- CTE (<150C): -10 ~10 ppm/C
(depends on glass-fabric and resin content)
Singi™FC
Flexible siloxane elastomer formulation
Specification (QFRP Film)
~40mm film with quartz-fabric (Shinetsu SQ, 30mm), ~50% resin content
Tensile Test
- Tensile strength : 133 MPa
- Elastic modulus : 1.6 GPa
- Elastic strain : ~7%
Thermal Expansion
- CTE (<150C): 18ppm/C
- CTE (>150C) : 2ppm/C
- Transition at 80C~150C
Microstrip line coupon
~40mm film with quartz-fabric (Shinetsu SQ, 30mm), ~50% resin content
Multilayer FPCB manufacture
~40mm film with quartz-fabric (Shinetsu SQ, 30mm), ~50% resin content
Singi™ Prepreg Specifications
